Manufacturing of electrical contacts

General information

  • Preparation of bond connections
  • Manufacturing of solder joints with custom temperature profiles

Technical data

  • Bonding device FEK 53xx Ball Deep Access
    Ball-Wedge for gold wires
    Deep Access Wedge-Wedge for gold and aluminum wires

  • Soldering oven Elpro HR-30
    60 cm chamber
    Definable temperature profiles (7 ranges) up to 260 °C reflow temperature

     

Required consumables / if necessary to purchase measurement-specific

  • Soldering paste
  • Bonding wires